Rack Assembly for Vertical Airflow Cooled Devices

ABSTRACT

An assembly includes a lower sub-assembly containing a first fan, a middle sub-assembly supported above the lower sub-assembly, a bottom air flow control plane supported in the middle sub-assembly and having openings sized to fit multiple computers having vertical cooling air paths, and a top air flow control plane supported in the middle sub-assembly above the bottom air flow control plane and having openings sized to fit the multiple computers such that air is forced through the vertical cooling air paths.

PRIORITY CLAIM

This application is a divisional application of U.S. Pat. ApplicationSerial Number 16/724,036, filed Dec. 20, 2019. entitled “Rack Assemblyfor Vertifical Airflow Cooled Devices”, which is hereby incorporated byreference herein in its entirety.

BACKGROUND

Data centers commonly house thousands of computers and associatedequipment to provide computing resources via network connections. Thecomputers in many instances take the form of blades that are insertedinto racks, with cooling air provided to ensure the blades do notoverheat. The use of computers in the form of blades and racks, allowssignificant density of computing power in a compact format.

Racks are commonly designed to accommodate computers that are arrangedin a blade format. The airflow proceeds horizontally through the blades.Some computers are not arranged in a blade format but may take shapesthat are not conducive to a high-density arrangement in an equipmentrack. In addition, some such computers are designed to sit upright on adesktop and may require the upright orientation where air flowsvertically through the computers to properly cool the computers. It canbe difficult to design racks that can hold a high density of suchcomputers and still provide sufficient cooling air to keep the computersin a desirable operating temperature range.

SUMMARY

An assembly includes a lower sub-assembly containing a first fan, amiddle sub-assembly supported above the lower sub-assembly, a bottom airflow control plane supported in the middle sub-assembly and havingopenings sized to fit multiple computers having vertical cooling airpaths, and a top air flow control plane supported in the middlesub-assembly above the bottom air flow control plane and having openingssized to fit the multiple computers such that air is forced through thevertical cooling air paths

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block perspective view of a portion of an equipment rack forcooling equipment requiring vertical airflow according to an exampleembodiment.

FIG. 2 is a perspective view of a third sub-assembly according to anexample embodiment.

FIG. 3 is perspective view of the second sub-assembly according to anexample embodiment.

FIG. 4 is a rear elevation view of an assembly according to an exampleembodiment.

FIG. 5 is a rear elevation view of a computer illustrating examplepositioning of airflow control planes according to an exampleembodiment.

FIG. 6 is a top view of the upper airflow control plane according to anexample embodiment.

FIG. 7 is a side view of the upper airflow control plane according to anexample embodiment.

FIG. 8 is a block diagram illustrating a rack with four assembliesarranged in a stack according to an example embodiment.

FIG. 9 is a block diagram illustrating airflow within an exampleassembly.

DETAILED DESCRIPTION

In the following description, reference is made to the accompanyingdrawings that form a part hereof, and in which is shown by way ofillustration specific embodiments which may be practiced. Theseembodiments are described in sufficient detail to enable those skilledin the art to practice the invention, and it is to be understood thatother embodiments may be utilized, and that structural, logical andelectrical changes may be made without departing from the scope of thepresent invention. The following description of example embodiments is,therefore, not to be taken in a limited sense, and the scope of thepresent invention is defined by the appended claims.

An improved assembly for an equipment rack is modified to handlecomputing hardware that utilizes vertical airflow for cooling. Racksusing the improved assembly may hold a higher density of such hardwarethan prior racks, making it better suited for datacenters, wherehundreds if not thousands of hardware devices may be housed. Air flow tocool the hardware devices is provided from below the hardware devicesand is carried upward through fan action of the hardware devices asopposed to being conveyed horizontally in prior assembly designs.

In addition, the improved assembly allows a rack of assemblies eachholding multiple hardware devices, to be easily serviced/replaced viaslides supporting subassemblies. One sub-assembly may hold computers,and a further sub-assembly may include additional devices, such asstorage media cards, networking cards, and power supplies. Thesub-assemblies may be quickly accessed via slides. The sub-assemblieswith slides may be thought of as pull-out drawers.

FIG. 1 is a perspective view of a portion of an equipment rack indicatedgenerally at 100. An assembly 110 is supported by multiple rails 115comprising the equipment rack 100. Only one assembly 110 is shown, butthe rails 115 may support multiple assemblies in various embodiments.Assembly 110 in one embodiment forms an enclosure that containsequipment, such as computers, storage devices, network cards, powersupplies/power bricks, power boards, and other devices, one or more ofwhich generate heat during operation. In one embodiment, the computers,such as Mac Pro® computers, are designed for vertical orientation duringoperation, drawing cooling air in through a bottom of the computerchassis, through the chassis, and out through a top of the chassis.

Assembly 110 in one embodiment includes multiple subassemblies. A firstsub-assembly 120, referred to as an upper sub-assembly, comprises aplenum, basically an open space permitting airflow through it. One ormore fans, referred to as a fan, to exhaust air to ambient may beprovided to facilitate airflow through the first sub-assembly 120 butare not visible in this perspective view. The first sub-assembly 120 hasa handle 122 for facilitating lifting of the first sub-assembly 120 toprovide access to equipment, such as computers for installation andservice. The first sub-assembly has sides, a front, a back, and a top,all formed of sheet metal that may be fairly light weight, such as⅛^(th) inch steel sheet metal or other material providing sufficientstructural support and heat conductivity.

The top may be formed as a double wall baffle to minimize the transferof heat to adjacent assemblies when assembly 110 is installed in a rack.The double wall baffle may have holes or vents 123 positioned betweenthe double walls to facilitate such heat transfer. Both ends of thedouble wall baffle may have holes, allow airflow through the double wallbaffles. There may be about 1 cm between the double walls in oneembodiment. Vent sizes and location may vary but vents should bepositioned to radiate heat accumulating between the double walls.

The first sub-assembly 120 is supported by a second sub-assembly 130,referred to as a middle sub-assembly. The second sub-assembly issupported by a pair of slides 135 coupled to pair of rails 115. Thecombination of middle sub-assembly 130 and rails 115 may be referred toas a sled. A handle 137 on a front of second sub-assembly 130facilitates movement of the second sub-assembly 130 in a drawer openingand closing like manner to allow access to equipment, such as computersthat are mounted within and supported by the second sub-assembly 130.

Note that the first subassembly 120 moves laterally with the secondsub-assembly 130 via the slides 135. As with the first sub-assembly 120,the second subassembly 130 has a front, back, and sides formed of sheetmetal that may be fairly light weight, such as ⅛^(th) inch steel sheetmetal or other material providing sufficient structural support and heatconductivity.

A third sub-assembly 140, referred to as a lower sub-assembly, includesa fan 145 for blowing air into the assembly 110. Note that fan 145, suchas an array of fans, are mounted on a front side of third sub-assembly140 corresponding to a front side of assembly 110. The front side isopposite a back side of assembly 110 where the fans of firstsub-assembly 120 are supported.

The arrangement of fans on opposite sides and different levels of theassembly 110 facilitates movement of air through the front side of theassembly 110 via fan 145 to the backside of the assembly 110 with achange in elevation, thus moving air vertically through the secondsub-assembly 130. The air movement via the sets of fans is referred toas a push-pull arrangement.

As with the first sub-assembly 120, the second subassembly 130 has afront, back and sides formed of sheet metal that may be fairly lightweight, such as ⅛^(th) inch steel sheet metal or other materialproviding sufficient structural support and heat conductivity. Inaddition, a bottom plate may be formed of thicker, light weight aluminumto support additional weight. A handle 147 may be used to move the thirdsub-assembly 140 via rails 150 in a manner similar to the movement ofthe second sub-assembly 130.

The sub-assemblies 120, 130, 140 may be formed of sheet metal or othersuitable material in various embodiments, and when assembled togetherinto the assembly 110 provide a substantially sealed enclosure to createan airpath to move cooling air past the equipment therein.

FIG. 2 is a perspective view of the third sub-assembly 140 showing aninterior of the third sub-assembly 140. Note that like elements may beidentified with the same reference number in multiple figures. Thirdsub-assembly 140 is a bottom sub-assembly that includes the fan 145 fordrawing in air. Multiple different electrical cards 215 are supported bya base 210 of third sub-assembly 140. Example cards include networkcards, storage cards, thunderbolt cards and others. Power supplies 220may also be included. The fan 145 draw air into and past the cards. Thetop of the third sub-assembly 140 is open in one embodiment but will beenclosed by a lower plane of the second sub-assembly 130 during use.

In one embodiment, there are ten sets of cards 215, each setcorresponding to a computer supported in the second sub-assembly 130 andconnected to such computers by cabling.

FIG. 3 is block perspective view of the second sub-assembly 130 mountedabove the third sub-assembly 140 and having a lower airflow controlplane 310 that both encloses the third sub-assembly 140 and holdsmultiple computers 320 in position within the second sub-assembly 130.Note that the sides of the sub-assemblies 130, 140 are not shown tobetter illustrate their interior construction.

The computers 320 are supported by multiple bars 310 extending widthwisefrom side to side of the second sub-assembly 130. In furtherembodiments, the bars may extend lengthwise from the front of the secondsub-assembly 130 to the back of the second subassembly 130. In oneembodiment, ten such computers are supported in multiple staggered rows.Outside rows of computers 320 include four computers 120, with a middlerow of two computers 320 between. The two computers in the middle roware staggered between the computers in the rows of four computer 320.The bars 325 have a cross section width that is less than the width orradius of the computers 320. In one embodiment, the computers 320comprise MAC Pro® computers, which include internal fans that draw airin from their bottom portions and expel air out their top portion.

The bars 325 may include cross bars running width-wise to furthersupport the computers 320. The bars 325 may be supported by the sides ofsub-assembly 130 in various embodiments and may be formed of steel orother suitable material for supporting the weight of the computers 320.

The lower airflow control plane 310 serves to both divert air into thebottom portions of the computers 320 and also includes openings 326having perimeters that closely match the perimeters of the computer 320to hold the computers 320 snugly in place. The openings may bepositioned to ensure adequate structural support for computers 320 andto optimize the number of computers 320 that may be placed and supportedwithin the second sub-assembly 130.

The lower airflow control plane 310 may include one or more openings forcables running between the cards and power supplies supported in thethird sub-assembly 140. Such opening or openings should be sized toallow passage of the cables with minimal air leakage through suchopenings to optimize airflow through the computers 320.

An upper airflow control plane 330 is positioned below the tops of thecomputers to create an upper level airflow path toward rear fans 335that may be positioned to exhaust air from the upper level airflow path.The first sub-assembly 110, not shown in FIG. 3 , acts to enclose theupper level airflow path. The rear fans 335 may be supported by theupper airflow control plane 330, the first sub-assembly 110, or a rearpanel of the second sub-assembly 120 in various embodiments. The airflowcontrol planes 310, 330 may have a pan type of shape, with raised edgesto provide structural support.

The upper airflow control plane 330 may having similarly positionedopenings 327 for the computers 320 but are slightly larger in diameterto allow easier insertion and removal of computers 320. The sides of thesecond sub-assembly may have support structures to support the lower andupper airflow control planes. In addition, the upper airflow controlplane 330 may include handles (not shown in FIG. 3 ) that extend up intothe first sub-assembly plenum space for ease of removal to service thecomputers 320.

In some embodiments, the upper airflow control plane 330 may beoptional, and the rear fans 335 may be supported by sides of the secondsub-assembly 130. However, the upper airflow control plane 330 enhancesthe vertical airflow through the computers 320 and provides for a moreefficient overall airflow path out the rear fans 335. preventing heatbuildup in eddies that may form in a more open space and resultant hotspots.

FIG. 4 is a rear elevation view of the assembly 110 illustrating theback of the assembly 110 and showing the fans 335. An optional openingin the rear of assembly 110 is shown to allow access to cables duringdesign.

FIG. 5 is a rear elevation view of a computer 320. Upper and lowerairflow control planes 330 and 310 are illustrated as lines todemonstrate the relative positioning of the airflow control planes 310,330 with respect to cable access to a connection portion of the computer320. The particular computer shown is a Mac Pro® computer. There areseveral connections that end up being accessible between the airflowcontrol planes in one embodiment, including a power connection 500,ethernet connection 505, Thunderbolt 2 connections 510, USB ports 515,power switch 520, and others.

The airflow control planes 310, 330 thus provide a pair of barriers toairflow to allow access to the connections and ports of computer 320 andensure the majority of cooling air flow proceeds vertically through thecomputers 320. Note that for different computers, the placement of theairflow control planes may be varied as a function of the location ofthe connections and ports. For instance, a non-planar lower air flowcontrol plane may be used to allow access to one or more particularports while still maintaining desired airflow characteristics andavoiding significant eddy currents. In one embodiment, the upper airflowcontrol plane 330 may be omitted. While the upper airflow control plane330 reduces the potential for eddy currents, the assembly will stilloperate without such a control plane. The upper airflow control plane330 also helps maintain the computers 320 in place for shipment and droptesting.

In one embodiment, computer 320 includes air vents 550 around a bottomof the computer 320, which are used for allowing air to enter thecomputer 320 and proceed vertically therethrough. The use of bars 325 tosupport the computers 320 ensures that air can flow freely from thethird sub-assembly to the bottoms of the computers 320, while the lowerairflow control plane 310 ensures the majority of airflow proceedsvertically through the computers 320.

FIG. 6 is a top view of the upper airflow control plane 330 illustratingthe placement of holes or openings 600 for computers 320. As previouslyindicated, there are two outside rows of four openings and a pair ofopenings between the outside rows. There are ten openings 600 for tencomputers 320.

FIG. 7 is a side view of the upper airflow control plane 330. A handle700 is shown rising up from a base of control plane 330. The handle 700in one embodiment extends into the plenum for ease of access and removalof the upper airflow control plane 330. A gripping opening 710 may beprovided near an apex of the handle 700.

The handle 700 may take many different shapes and in one embodiment issimply stamped from a same piece of sheet metal as is used for formingthe upper airflow control plane 330 and is bent upward substantiallyorthogonal or otherwise to facilitate removal and insertion of the upperairflow control plane 330. One handle 700 is shown on one side of theupper airflow control plane 330. An opposite side of the upper airflowcontrol plane 330 may have a additional handle 700 that may have thesame shape.

FIG. 8 is a block diagram illustrating a rack 800 with four assemblies110 arranged in a stack. Commercially available rails sold at least byDell may be used. Other equipment 810 may be included as shown. In oneembodiment, a delta rack automatic transfer switch (ATS) for powertransfer may be used with Dell ready rails for building the rack andproviding the drawer like capability for any of the sub-assemblies shownor described herein. Air inlets 820 may also be provided for eachassembly 110.

FIG. 9 is a block diagram illustrating airflow within an exampleassembly 900. Assembly 900 includes walls 905 providing an enclosedvolume 907 in which computers 910 may be supported. A bottom airflowcontrol plane 915 extends across the enclosed volume 907 to position thecomputers 910 in a desired manner to optimize the number of computersthat can be enclosed in the enclosed volume 907.

Assembly 900 is divided into three sub-assemblies in one embodiment, atop sub-assembly 920, a middle sub-assembly 925, and a lowersub-assembly 930. Control planes 915 and 920 are supported within themiddle sub-assembly 925. which also houses the multiple computers 910.Bottom sub-assembly 930 may include multiple cards and power suppliesindicated at 935. Power supplies may include fans that vent outside thebottom sub-assembly 935 as indicated by arrow 938.

In operation, fans at 950 and 965 operate to push the air in to thelower subassembly, also referred to as a bottom drawer to cool the cards935 and pressurize the bottom draw to supply intake air to the computers910 for cooling. The bottom drawer may also have one or more powersupplies 935 which blows part of the incoming air out their backs at 938to cool the power supplies.

The top sub-assembly 920 comprises a top 940. In one embodiment, the top940 has a double wall as indicated at 940 and 942, which serves as aninsulator for the assembly 940 and removes heat from assembly 900 asindicated by arrows 945.

Multiple arrows 945, 950, 955, 960, and 965 are used in FIG. 9 toindicate airflow. In one embodiment, air enters the lower assembly 930as indicated at arrow 950. The air may be moved via a fan such as anarray of fans (not shown in FIG. 9 ) at the entry point. The airflowproceeds toward the computers 910 and may assist in removing heatgenerated by the cards and power supplies 935. The airflow proceeds intoa base of the computers 910 as indicated at arrow 955 and furtherproceeds out the top of the computers 910 as indicated at arrow 960.Note that while arrow 955 shows air entering through the bottom ofcomputers 910, the actual flow may enter the computers 910 through ventson the sides of the computers near their bottoms.

The airflow through the computers picks up heat generated by operationof the computers and is confined by the top 940. The airflow thenproceeds to exit the middle sub-assembly as indicated by arrow 965. Theexiting of the airflow may be added by a fan or array of fans (not shownin FIG. 9 ). Airflow through the computers 910 may also be assisted viaa fan or fans within the computers 910.

EXAMPLES

1. An assembly includes a lower sub-assembly containing a first fan amiddle sub-assembly supported above the lower sub-assembly, a bottom airflow control plane supported in the middle sub-assembly and havingopenings sized to fit multiple computers having vertical cooling airpaths, a top air flow control plane supported in the middle sub-assemblyabove the bottom air flow control plane and having openings sized to fitthe multiple computers such that air is forced through the verticalcooling air paths, and a top sub-assembly supported above the middlesub-assembly.

2. The assembly of example 1 and further comprising a second fandisposed above the top air flow control plane to act in cooperation withthe first fan to move air through the vertical cooling air paths of themultiple computers.

3. The assembly of example 2 wherein the top sub-assembly comprises adouble walled top and forms a plenum to facilitate air flow through thesecond fan.

4. The assembly of any of examples 1-3 and further comprising middlerails to moveably support the middle sub-assembly.

5. The assembly of example 4 and further comprising bottom rails tomovably support the bottom sub-assembly.

6. The assembly of any of examples 1-5 wherein the computers arecylindrical in shape and wherein the airflow control planes containround openings corresponding to the cylindrical shape of the computers.

7. The assembly of any of examples 1-6 wherein the openings in the topairflow control plane are larger than the openings in the bottom airflowcontrol plane.

8. The assembly of any of examples 1-7 wherein the lower sub-assemblycomprises multiple cards for storage and networking.

9. The assembly of example 8 wherein the bottom air flow control planehas an opening positioned to pass cables from the cards in the lowersub-assembly to the connectors of the computers in the middlesub-assembly.

10. The assembly of example 9 wherein the cables comprise networkcables, and wherein at least two network cables from cards are combinedinto a single network cable prior to passing through the opening in thebottom air flow control plane.

11. The assembly of any of examples 1-10 wherein the upper air flowcontrol plane includes handles extending upward to facilitate lifting ofthe upper air flow control plane for providing physical access to thecomputers.

12. A system includes a lower sub-assembly including a first fan, amiddle sub-assembly supported above the lower sub-assembly, a bottom airflow control plane supported in the middle sub-assembly and havingopenings sized to fit multiple computers having vertical cooling airpaths such that air is forced through the vertical cooling air paths,and a second fan disposed above the bottom air flow control plane to actin cooperation with the first fan to move air through the verticalcooling air paths of the multiple computers.

13. The system of example 12 and further comprising a plenum positionedabove the middle sub-assembly to facilitate air flow through the secondfan.

14. The system of any of examples 12-13 and further including middlerails to moveably support the middle sub-assembly and bottom rails tomovably support the bottom sub-assembly.

15. The system of any of examples 12-14 wherein the computers arecylindrical in shape and wherein the bottom airflow control planecontains round openings corresponding to the cylindrical shape of thecomputers.

16. The system of any of examples 12-15 wherein the lower sub-assemblycomprises multiple cards for storage and networking and one or morepower supplies each having a fan coupled to expel air outside theassembly to cool the one or more supplies.

17. The system of any of examples 12-16 and further comprising a topairflow control plane supported in the middle sub-assembly above thebottom air flow control plane and having openings sized to fit themultiple computers such that air is forced through the vertical coolingair paths.

18. A method includes supporting multiple computers at their bases viamultiple bars, wherein the bars are formed to allow airflow into thebases of the multiple computers, actively providing air to the bases ofthe multiple computers via a bottom fan, blocking vertical airflow alongan outside of the multiple computers via a bottom plane disposedpart-way up from the bases of the computers to ensure air flowsvertically through the multiple computers, and actively removing airfrom tops of the computers via a top fan.

19. The method of example 18 and further comprising assisting airflowvertically through the multiple computers via fans disposed inrespective multiple computers.

20. The method of any of examples 18-19 and further comprising coolingmultiple cards supported below the multiple computers with the air flowactively provided to the bases of the multiple computers.

Although a few embodiments have been described in detail above, othermodifications are possible. For example, the logic flows depicted in thefigures do not require the particular order shown, or sequential order,to achieve desirable results. Other steps may be provided, or steps maybe eliminated, from the described flows, and other components may beadded to, or removed from, the described systems. Other embodiments maybe within the scope of the following claims.

1. A method of cooling equipment in an enclosure, the method comprising:supporting multiple computers at their bases via multiple bars withinthe enclosure, wherein the bars are formed to allow airflow into thebases of the multiple computers; actively providing air from outside theenclosure to the bases of the multiple computers via a bottom fan;blocking vertical airflow along an outside of the multiple computers viaa bottom plane disposed part-way up from the bases of the computers toensure air flows vertically through the multiple computers; and activelyremoving air from tops of the computers via a top fan.
 2. The method ofclaim 1 and further comprising assisting airflow vertically through themultiple computers via fans disposed in the respective multiplecomputers.
 3. The method of claim 1 and further comprising coolingmultiple cards supported below the multiple computers with the air flowactively provided to the bases of the multiple computers.
 4. The methodof claim 3 wherein the bottom plane includes a cable opening to passcables from the cards through the bottom plane.
 5. The method of claim 4wherein the cables comprise network cables, and wherein at least twonetwork cables from cards are combined into a single network cable priorto passing through the opening in the bottom air flow control plane. 6.The method of claim 1 wherein the computers are cylindrical in shape andwherein the bottom plane comprises openings corresponding to thecylindrical shape of the computers.
 7. The method of claim 1 whereinactively removing air from the tops of the computers comprises using afan disposed above the bottom plane to blow air outside the enclosure.8. The method of claim 1 and further comprising: forming a top air flowcontrol plane at or below the tops of the computers, the top air flowcontrol plane having top plane openings sized to fit the multiplecomputers through the top plane openings; and disposing the top air flowcontrol plane above the bottom air flow control plane such that themultiple computers extend through the openings.
 9. The method of claim 1wherein actively removing air from the tops of the computer includesremoving such air from the enclosure.
 10. A method for cooling equipmentin an enclosure, the method comprising: supporting multiple computers attheir bases via multiple bars supported within the enclosure, whereinthe bars are formed to allow airflow into the bases of the multiplecomputers; actively providing air from outside the enclosure to thebases of the multiple computers via a bottom fan; positioning a bottomairflow control plane having bottom airflow control plane openings forthe computer, the bottom airflow control plane being supported withinthe enclosure at or above the bases of the computers to block verticalairflow along an outside of the multiple computers to ensure air flowsvertically through the multiple computers; positioning a top airflowcontrol plane supported within the enclosure above the bottom airflowcontrol plane and at or below tops of the computers, the top airflowcontrol plane having top airflow control plane openings that allowinsertion of the computers through the openings; actively removing airfrom tops of the computers via a top fan.
 11. The method of claim 10 andfurther comprising assisting airflow vertically through the multiplecomputers via fans disposed in the respective multiple computers. 12.The method of claim 10 and further comprising cooling multiple cardssupported below the multiple computers with the air flow activelyprovided to the bases of the multiple computers.
 13. The method of claim11 wherein the bottom plane includes a cable opening to pass cables fromthe cards through the bottom plane.
 14. The method of claim 12 whereinthe cables comprise network cables, and wherein at least two networkcables from cards are combined into a single network cable prior topassing through the opening in the bottom air flow control plane. 15.The method of claim 9 wherein the computers are cylindrical in shape andwherein the bottom airflow control plane openings are round tocorrespond to the cylindrical shape of the computers.
 16. The method ofclaim 9 wherein actively removing air from the tops of the computerscomprises using a fan disposed above the top airflow control plane toblow air outside the enclosure.
 17. The method of claim 9 whereinactively removing air from the tops of the computer includes removingsuch air from the enclosure.